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Discrete Assembly process
Discrete Process
Insertion Type
# of line
Capacity
(M - shot/Mth)
Lead Pitch
Min Board Size
 Max Board Size
Jumper
2
8.4
5-31 mm.
50*40 mm.
508*381 mm.
Axial
6
25
5-26 mm.
50*40 mm.
580*381 mm.
Radial
9
14.6
2.5, 5, 7.5 mm.
150*80 mm.
330*250 mm.
SMT process
SMT Process
Lines
14 lines
Capacity
102 million placements per month
Max Board Size
330*250 mm.
Min Components Size
1005 (0402)
Autosoldering process
Automatic Soldering System Process
Lines
8 lines (Lead free = 6 lines ,Pb = 2 lines)
Types
Dual wave
Max board width
230 mm.
Flux (Divide depart Auto soldering M/C)
8 lines (Lead free = 6 lines ,Pb = 2 lines)
 
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