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Discrete Assembly process
Discrete Process
Insertion Type
# of line
Capacity
(M - shot/Mth)
Lead Pitch
Min Board Size
 Max Board Size
Axial
6
25
5~26 mm.
150*60 mm.
508*371 mm.
Radial
9
14.6
5~11 mm.
90*60 mm.
330*250 mm.
Jumper
2
8.4
2.5~5 mm.
50*40 mm.
508*381 mm.
SMT process
SMT Process
Lines
14 lines
Capacity
102 million placements per month
Max Board Size
330*250 mm.
Min Components Size
1005 (0402)
Autosoldering process
Automatic Soldering System Process
Lines
8 lines (Lead free = 6 lines, Pb = 2 lines)
Types
Dual wave
Max board width
230 mm.
Flux (Divide depart Auto soldering M/C)
8 lines (Lead free = 6 lines, Pb = 2 lines)
 
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